Contamination of Electronic Assemblies

Contamination of Electronic Assemblies

The text is divided into four sections: Laminate Manufacturing, Substrate Fabrication, Printed Wiring Board Assembly, and Conformal Coatings.

Author: Elissa M. Bumiller

Publisher: CRC Press

ISBN: 0849314836

Category: Technology & Engineering

Page: 232

View: 813

Contamination problems have become a major factor in determining the manufacturability, quality, and reliability of electronic assemblies. Understanding the mechanics and chemistry of contamination has become necessary for improving quality and reliability and reducing costs of electronic assemblies. Designed as a practical guide, Contamination of Electronic Assemblies presents a generalized overview of contamination problems and serves as a problem-solving reference point. It takes a step-by-step approach to identifying contaminants and their effects on electronic products at each level of manufacture. The text is divided into four sections: Laminate Manufacturing, Substrate Fabrication, Printed Wiring Board Assembly, and Conformal Coatings. These sections discuss all aspects of contamination of electronic assemblies, from the manufacture of glass fibers used in the laminates to the complete assembly of the finished product. The authors present detection and control methods that can help you reduce defects during the manufacturing process. With tables, figures, and fishbone diagrams serving as a quick reference, Contamination of Electronic Assemblies will help you familiarize yourself with the origination, detection, measurement, control, and prevention of contamination in electronic assemblies.
Categories: Technology & Engineering

Contamination Effects on Electronic Products

Contamination Effects on Electronic Products

3 Contamination Sources : Assembly , Soldering , Cleaning , Coating , and Testing 3.1 OVERVIEW OF THE ASSEMBLY PROCESS The assembly of components and substrate , soldering , cleaning , coating , and assembly integration for the ...

Author: Tautscher

Publisher: CRC Press

ISBN: 0824784235

Category: Technology & Engineering

Page: 624

View: 286

The technology for preventing and mitigating contamination of electronic products is reviewed in four major ways: the types and sources of contaminants; typical contamination effects; contamination removal methods; and contamination prevention through design, process, product protection, and testing
Categories: Technology & Engineering

Corrosion of Electronic and Magnetic Materials

Corrosion of Electronic and Magnetic Materials

Residues and contamination of electronics acting as corrosion accelerators Production related contamination can be ... Flux residues are one of the most common and harmful residue sources that affect the reliability of PCB assemblies, ...

Author: L. Garfias-Mesias

Publisher: The Electrochemical Society

ISBN: 9781566778039

Category: Science

Page: 23

View: 336

The papers included in this issue of ECS Transactions were originally presented in the symposium ¿Corrosion of Electronic and Magnetic Materials¿, held during the 216th meeting of The Electrochemical Society, in Vienna, Austria from October 4 to 9, 2009.
Categories: Science

Soldering in Electronics Assembly

Soldering in Electronics Assembly

Grouping electronics assemblies into eight categories of end-use [Ellis, 1990 #25) and giving each category a quality rating, ... presumably as soldering processes improve and contamination of assemblies becomes less and less.

Author: MIKE JUDD

Publisher: Elsevier

ISBN: 008051734X

Category: Technology & Engineering

Page: 369

View: 401

Managers, engineers and technicians will use this book during industrial construction of electronics assemblies, whilst students can use the book to get a grasp of the variety of methods available, together with a discussion of technical concerns. It includes over 200 illustrations, including a photographic guide to defects, and contains many line drawings, tables and flow charts to illustrate the subject of electronics assembly. Soldering in Electronics Assembly looks theoretically at everything needed in a detailed study, but in a practical manner. It examines the soldering processes in the light of electronic assembly type; solder; flux; and cleaning requirements. It has information on every available process, from the most basic hand soldering through to latest innovatory ones such as inert atmosphere wave soldering and zoned forced convection infra-red machines. The book provides a detailed analysis of solder and soldering action; purpose of flux and relevant flux types for any application; classification of assembly variants; assessment and maintenance of solderability. There is also a detailed analysis of soldering process defects and causes. In addition, Soldering in Electronics Assembly contains a new chapter on Ball Grid Array (BGA) technology. A practical guide for the industry covering all the main soldering processes currently in use Cleaning, faults, troubleshooting and standards are all major topics Considers safety and solder process quality assessment
Categories: Technology & Engineering

The Electronics Assembly Handbook

The Electronics Assembly Handbook

As an extra precaution, functional/environmental tests of the assembly or product should be performed. Contamination Cleaning is a process by which contaminants or soils are removed. In cleaning SMAs, the prime cleansing task is ...

Author: Frank Riley

Publisher: Springer Science & Business Media

ISBN: 9783662131619

Category: Technology & Engineering

Page: 603

View: 142

The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in "Assembly Engineering" and "Electronic Packaging and Production", will provide an essential reference for engineers working in this field, including material on Multi Layer Boards, Chip-on-board and numerous case studies. Frank J. Riley is senior vice-president of the Bodine Corporation and a world authority on assembly automation.
Categories: Technology & Engineering

Humidity and Electronics

Humidity and Electronics

[19] H. Conseil, M.S. Jellesen, R. Ambat, Contamination profile on typical printed circuit board assemblies vs soldering process, Solder. Surf. Mt. Technol., 26 (4) (2014) 194À202. [20] K. Piotrowska, M.S. Jellesen, R. Ambat, ...

Author: Rajan Ambat

Publisher: Woodhead Publishing

ISBN: 9780323908542

Category: Technology & Engineering

Page: 398

View: 564

Humidity and Electronics: Corrosion Reliability Issues and Preventive Measures provides comprehensive information on humidity related corrosion reliability issues surrounding electronics and how to tackle potential issues from a pro-active-design-prevention perspective. The book contains a mix of academic and industrial relevance, making it suitable for a detailed understanding on humidity issues on electronics, both for materials and corrosion experts and electronics and electrical experts. It will be useful for researchers, academics, and industrial personals involved in materials, corrosion, and electronics reliability aspects. Provides basic and applied knowledge surrounding corrosion in electronics Combines electronics/electrical and electrochemical aspects related to failure modes and mechanisms Presents knowledge on influencing factors and how they can be used as preventive measures at the material, component, device and system level
Categories: Technology & Engineering

Research Reports

Research Reports

... of heat and radiation on electronic components that have been deliberately contaminated with known concentrations ... This study cannot be carried out effectively if only natural contamination is used, because natural contamination ...

Author: USAF School of Aerospace Medicine

Publisher:

ISBN: UCAL:C2732763

Category:

Page:

View: 263

Categories:

Reliability Engineering

Reliability Engineering

[8.3] Ellis B.N., Cleaning and Contamination of Electronics Components and Assemblies, 1986, Electrochemical Publ., Ayr (Scotland). [8.4] Hnatek E. R., Integrated Circuit Quality and Reliability, 2nd ed. 1999, Dekker, NY.

Author: Alessandro Birolini

Publisher: Springer

ISBN: 9783662542095

Category: Technology & Engineering

Page: 651

View: 572

This book shows how to build in and assess reliability, availability, maintainability, and safety (RAMS) of components, equipment, and systems. It presents the state of the art of reliability (RAMS) engineering, in theory & practice, and is based on over 30 years author's experience in this field, half in industry and half as Professor of Reliability Engineering at the ETH, Zurich. The book structure allows rapid access to practical results. Methods & tools are given in a way that they can be tailored to cover different RAMS requirement levels. Thanks to Appendices A6 - A8 the book is mathematically self-contained, and can be used as a textbook or as a desktop reference with a large number of tables (60), figures (210), and examples / exercises^ 10,000 per year since 2013) were the motivation for this final edition, the 13th since 1985, including German editions. Extended and carefully reviewed to improve accuracy, it represents the continuous improvement effort to satisfy reader's needs and confidence. New are an introduction to risk management with structurally new models based on semi-Markov processes & to the concept of mean time to accident, reliability & availability of a k-out-of-n redundancy with arbitrary repair rate for n - k=2, 10 new homework problems, and refinements, in particular, on multiple failure mechanisms, approximate expressions, incomplete coverage, data analysis, and comments on ë, MTBF, MTTF, MTTR, R, PA.
Categories: Technology & Engineering

Developments in Surface Contamination and Cleaning Fundamentals and Applied Aspects

Developments in Surface Contamination and Cleaning   Fundamentals and Applied Aspects

Last but not least, the water used in the cleaning process can be a major source of ionic contamination. Cleaning processes for electronic boards and components should only use DI water; unfortunately, some manufacturers still use tap ...

Author: Rajiv Kohli

Publisher: Elsevier

ISBN: 9780815516859

Category: Science

Page: 1200

View: 697

Surface contamination is of cardinal importance in a host of technologies and industries, ranging from microelectronics to optics to automotive to biomedical. Thus, the need to understand the causes of surface contamination and their removal is very patent. Generally speaking, there are two broad categories of surface contaminants: film-type and particulates. In the world of shrinking dimensions, such as the ever-decreasing size of microelectronic devices, there is an intensified need to understand the behavior of nanoscale particles and to devise ways to remove them to an acceptable level. Particles which were functionally innocuous a few years ago are ôkiller defectsö today, with serious implications for yield and reliability of the components. This book addresses the sources, detection, characterization and removal of both kinds of contaminants, as well as ways to prevent surfaces from being contaminated. A number of techniques to monitor the level of cleanliness are also discussed. Special emphasis is placed on the behaviour of nanoscale particles. The book is amply referenced and profusely illustrated. • Excellent reference for a host of technologies and industries ranging from microelectronics to optics to automotive to biomedical. • A single source document addressing everything from the sources of contamination to their removal and prevention. • Amply referenced and profusely illustrated.
Categories: Science